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| Home >> Manufacturer Index >> Arctic Silver Products >> |
Arctic Silver Ceramique Thermal Compound, 2.5 gramsThe high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.Features: Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer. This exclusive combination provides performance exceeding most metal based compounds. Controlled triple phase viscosity. Ceramique does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability. During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final consistency designed for long-term stability. Stability: Ceramique is engineered to not separate, run, migrate, or bleed. Electrical Insulator. Ceramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive. Temperature Limits. Peak: – 40oC to > 180oC; Long-Term: – 40oC to 140oC. References: | Arctic Silver Company Website | Limited Warranty: No credit or refund. Notes: (1) Apply only a very small amount for each application. Read instructions carefully. (2) Never turn on a computer without a heatsink properly mounted on the CPU with a thermal interface material between the CPU core and the heatsink. A modern high-performance CPU can be permanently damaged in less than 5 seconds without a heatsink. (3) Ceramique is a grease, not an adhesive. It cannot be used to glue a heatsink to a chip. To permanently glue a heatsink to a chip that does not have any other attachment method, please use Arctic Silver Adhesive or Arctic Alumina Adhesive. (4) Due to the unique shapes and sizes of the particles in Ceramique, it will take a minimum of 12 hours to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop slightly over this "break-in" period. (ud: Steven-110905) Related Items: | Thermal Compounds | Overclocking | Case Mods | Temperature Sensors | Quiet PC Parts | Heatsink, Shims | Arctic Silver 5 Thermal Compound, 12grams | Arctic Silver 5 Thermal Compound, 3.5grams | Arctic Silver Ceramique Thermal Compound, 22 grams | | |||||||
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