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| Home >> Case Mods & Lights >> Cooling / Cooling Supplies >> Cooling, Watercooling >> Cooling Accessories >> Thermal Compound >> Sold Out Items >> |
IC Diamond 7 Carat Thermal Compound, 1.5 gramIC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity.Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver. Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive. Features: Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 92% by weight, 94% after 10 minute dry-out prior to heat sink installation. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling. Superior bulk conductivity. Excellent thermal impedance. Tight particle distributions. < 40 µ maximum particle diameter. Silicone free. Lower viscosity. Greater stability. Non capacitive or electrically conductive. Application: IC Diamond is composed mostly of diamond powder, and as such is quite thick. Proper application is critical to optimum performance. Squeeze onto the center of the CPU an amount of IC Diamond compound about the size of a pea - the center of the CPU is where most heat is concentrated. Place the heatsink on the CPU and push down to spread IC Diamond over the CPU's surface. Clamp the heatsink and power up the PC. Curing Time: IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use. Stability: IC Diamond is designed for stability - it will not bleed or separate in normal use. Specifications: Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D - 5470 thermal interface test instrument). Thermal Resistance: 0.25°C-cm2/W@ 100 µ BLT. Average Particle Size: <40 µ maximum particle diameter. Compliancy: RoHS Compliant. References: | IC Company Website | Limited Warranty: No credit or refund. (duck110707) Notes: (1) The statements and technical information contained herein are based on tests and data which Innovation Cooling believes to be reliable, but the accuracy or completeness of such statements and technical information is not guaranteed. User is responsible for determining whether a specific Innovation Cooling product is fit for a particular purpose and suitable for user's method of application. Please remember that many factors can affect the use and performance of an Innovation Cooling product in a particular application. The materials to be bonded with the product, the surface preparation of those materials, the product selected for use, the conditions in which the product is used, and the time and environmental conditions in which the product is expected to perform are among the many factors that can affect the use and performance of an Innovation Cooling product. (2) Given the variety of factors that can affect the use and performance of an Innovation Cooling product, some of which are uniquely within the user's knowledge and control, it is essential that the user evaluate the Innovation Cooling product to determine whether it is fit for a particular purpose and suitable for the user's method of application. Related Items: | Thermal Compound | Overclocking | CPU Coolers | Temperature Sensing | Heatsinks & Shims | |
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