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The Flex EX memory series features breakneck speeds demanded by enthusiasts in an updated compact form factor to maximize memory configurations on your motherboard. These premium high-density modules operate at incredibly fast DDR2 and DDR3 speeds to run the latest memory-intensive games and applications, and offer enthusiasts the thermal management necessary for the stability and performance on high-end gaming and overclocking systems.
Features:
Flex EX XLC Heatsink: The OCZ Flex EX heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each Flex EX memory module features this breakthrough thermal management technology from OCZ, combining an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module's Ics in a thinner form factor. This latest series was engineered with a unique "flexible" design to give enthusiasts the option to run the modules passively or water cooled via the array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
2.25 EVP: OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 2.25V without invalidating their OCZ Lifetime Warranty.
Limited Warranty: Life-time equal replacement warranty. Physical damage not covered. 7-Day money back from receiving date with 15% restocking fee on current market price. No refund or upgrade after 7 days. Customer is responsible for returning manufacturer defective products including DOA unless testing is paid before shipping. (dxy082109)