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Mushkin Blackline 16GB (2x8GB) 240-Pin DDR3 1600MHz (PC3-12800) Dual Channel Kit Desktop Memory 997112, 9-9-9-24, 1.35V, w/ Ridgeback Heatsink
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Home >> Memory, USB Drives >> Shop by Interface >> Desktop 240-Pin DDR3 Memory >> DDR3 1333MHz >> 

Click to enlargeOCZ OCZ3G1333LV4GK 4GB(2x2048MB) DDR3 1333MHz (PC3-10666) Gold Low Voltage Dual Channel Memory Kit, 240pin, CL 9-9-9-20, 1.65V, Gold Layered Z3 XTC Heatspreader

More Items by OCZ


dis: OCZ OCZ3G1333LV4GK 4GB (2x2GB) DDR3 1333MHz (PC3-10666) Gold Low Voltage Dual Channel Memory Kit, 240pin, CL 9-9-9-20

Sorry! This item is currently out of stock. Alternatives can be found by searching above




*Physical damage by user will void your warranty: 
*Discrepancy & Shipping damage must be reported within 7 days: 
Part Number: DIMM-OCZ3G1333LV4GK
Regular price:$19.99On Sale: $14.99

OCZ OCZ3G1333LV4GK 4GB(2x2048MB) DDR3 1333MHz (PC3-10666) Gold Low Voltage Dual Channel Memory Kit, 240pin, CL 9-9-9-20, 1.65V, Gold Layered Z3 XTC Heatspreader


OCZ low-voltage DDR3 kits are designed specifically for the Intel P55 Chipset and subsequent Intel Core i7, i5, and i3 (Socket 1156) processors. Configured for dual channel mode, these ultra-compatible 4GB kits ensure optimal performance with an ideal combination of low power requirements at 1333MHz.

Specifications:
  • P/N: OCZ3G1333LV4GK
  • Capacity: 4GB (2x2GB)
  • Frequency: DDR3 1333MHz (PC3-10666)
  • Latency: 9-9-9-20
  • Parity: Unbuffered
  • Voltage: 1.65V**
  • Pins: 240
  • Heatsink: Gold Layered Z3 XTC Heatspreader*


References: | OCZ OCZ3G1333LV4GK Memory Website |

Limited Warranty: Life-time equal replacement warranty. Physical damage not covered. 7-Day money back from receiving date with 15% restocking fee on current market price. No refund or upgrade after 7 days. Customer is responsible for returning manufacturer defective products including DOA unless testing is paid before shipping. (Ianna010510) (ud Carry-030110)

Notes: (1) * XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained. (2) **OCZ's dual channel low voltage memory was specifically developed for the Intel CoreTM i7, i5, and i3 processors to provide unparalleled compatibility and performance when installed in one of these cutting-edge platforms.

Related Items: | OCZ Technology Memory Products | OCZ DDR3 1333 / 1066 | DDR3 1333MHz | Desktop 240-Pin DDR3 Memory | Dual Channel DDR3 Kits | Memory Heatsinks |

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