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Heat Sink Thermal CompoundType 44 heat sink compound. Extra high-efficiency heat transfer compound. Recommended to remove air gaps between microprocessors and heat sink. Great to ensure smooth contact and heat removal. Recommended for all microprocessors, especially AMD K6II, K6III, Athlon and overclocking.Made by GC Electronics. Re-packed by Directron.com in individual plastic vials with stoppers. No label. Each vial contains enough paste for at least three (3) applications. Great for individual usage. Related Items: For tech rooms where the compound may be needed more often, consider purchasing the 2.5OZ tube, which will last much longer. Other Tools Features: Non-contaminating synthetic ester base. Non-silicone base. Smooth white homogeneous paste. Excellent heat transfer. No separation or bleed. Type 44 is recommended as a heat transfer medium for use with all electronic components such as power transistors, diodes, resistors, etc. Type 44 has a life expectancy far exceeding that of all known types of electronic circuitry in both normal and extreme environments. Latest development in heat sink compounds, created to meet the need for a non-contaminating and more efficient thermal transfer compound. Type 44 is a non-creeping synthetic ester based compound that exhibits virtually no bleed or evaporation over a wide temperature range, even in a vacuum. Type 44 transfers 46% more efficiency than the best silicone products and 63% better than most olefin products. Type 44 is the only heat sink compound meeting Western Electric specifications KS21343 and it exceeds military performance MIL-C-47113. Specifications: Solids content, w.%: 65% minimum. Thermal conductivity @ 36 degree C: 16.7x10-4 cal/sec CM, min. Bleed, 24 hrs. @ 200 degree C, wt.%, 0.1% maximum. Evaporation, 24 hrs. @ 200 degree C, wt.%, 0.6%. Volume resistivity, 1.65x10-14 Ohms/CM. Dielectric strength, 305 Volts/Mil. Specific gravity at 60 degree F, 2.7. Penetration, 250-350. Operating range, -40 to 200 degree C. Application Instructions: Use a wood stick to apply a small quantity of the thermal compound on the heat sink where contact is made with the processor. The contact area is much smaller than the physical size of the cooler and the processor. Spread the compound slightly on the heat sink to cover the contact area with a very thin film (0.003-0.005 inch). Attach the heat sink to the processor. Move the heat sink slightly and gently against the processor. The goal is to eliminate the air gap. The heat generated by the processor once running will help dispersing the compound evenly. Do not over apply the paste. Too much is worse than not enough. Avoid letting the compound in contact with the CPU pins and circuit boards. You must remove the thermally conductive adhesive tapes that come with some brands of heat sinks before applying the thermal compound. Thermal compound is three times better than the double-sided pressure sensitive adhesive films. If you are upgrading a new processor or a new heat sink, make sure you remove the residual thermal grease (thermal interface material). Notes: (1) For optimal results, store this product in a cool area. Use the stopper for future applications. Keep it out of reach of children. (2) Directron.com has a $10 minimum-order requirement. You may select other <$10 items to meet the requirement. | Pentium II&III | FC-PGA | Xeon | Pentium IV | Coolers | | Overclocking | Manufacturers | How-to-Choose | News | Best buys at discount prices. Wholesale distributor. Onsale computer parts. | ||||||
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