Details
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
Features:
- High Thermal Conductivity
- Low Thermal Resistance
- Non-Curing
- Non-Corrosive
- Easy Application with Included Razor Blade
Specifications:
- Model: RG-TF4-TGU1-GP
- Color: Gray
- Specific Gravity: 3.5
- Thermal Conductivity: 2.89 (W/m-K)
- Volume Resistivity: 2.0E+10 (ohm-cm)
- BLT (Bond Line Thickness): 0.008 (mm)
- Volatile content: < 0.1 (%)
- Thermal Resistance: 0.032 (degree Celsius-cm2/W)
- Weight: 4g
- UPC Code: 884102002687